Function Follows Form: 3D Circuitry with LDS Technology

Laser Direct Structuring

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Apply circuitry directly on geometric or free-form shapes

With LPKF’s Laser Direct Structuring process (LDS) it is possible to produce circuit layouts on geometric or free-form shapes. Designers are enabled to meet ongoing demands for integrating more functions in ever-smaller spaces on plastic components, the so called 3D-MIDs.

The goal of 3D-MIDs is to unite electrical and mechanical functions in a single construction unit. The circuit tracks are integrated here into the housing as a substitute for a conventional printed circuit board. As a result, weight and fitting space can be effectively reduced.

Like to know more? Order your free copy of the LDS brochure today!

LPKF Laser & Electronics SE  •  Osteriede 7  •  30827 Garbsen  •  Germany  •  Tel.: +49 (0) 5131 7095-0  •  Fax: +49 (0) 5131 7095-90
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