Easy Stacking for MEMS Packaging with LDS

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LDS technology opens the door for three dimensional MEMS/ sensor packages

These three dimensional packages simplifies the stacking of bare dies. The dies can be assembly by secure wire bonding and flip chip technology.

The LPKF-LDS technology can provide plated through-holes to connect surfaces of MIDs. Furthermore this technology can reduce process steps like eliminating the bumping process because the bumps are made directly in the molding process and be activated and plated together with the circuitry in the following steps.

To find out more about the LDS Technology for MEMS packaging use the form to order your free brochure.

LPKF Laser & Electronics SE • Osteriede 7 • 30827 Garbsen • Germany • Tel.: +49 (0) 5131 7095-0 • Fax: +49 (0) 5131 7095-90