Powerful and compact:
Laser Depaneling with LPKF

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Laser depaneling with the LPKF MicroLine 2000: high-output and inline-capable
The LPKF MicroLine 2000 is an automated UV laser system for depaneling of rigid and flexible PCBs. The laser system can cut any contours without mechanical conversions and allows production runs with high variance.
An integrated SMEMA interface and a newly developed handling system allow the MicroLine 2000 systems to be integrated in the customers’ own production lines.
Like to know more? Order your free copy of the MicroLine 2000 brochure today!