Powerful and compact:
Laser Depaneling with LPKF

Laser Depaneling with the MicroLine 2000 Ci

Get your free copy of the brochure

Please fill out the form to receive a free copy.
We do not pass on any data to third parties. You can opt-out of our email service at any time.
form configuration error: no such mediafile in this language

Laser depaneling with the LPKF MicroLine 2000: high-output and inline-capable

The LPKF MicroLine 2000 is an automated UV laser system for depaneling of rigid and flexible PCBs. The laser system can cut any contours without mechanical conversions and allows production runs with high variance.

An integrated SMEMA interface and a newly developed handling system allow the MicroLine 2000 systems to be integrated in the customers’ own production lines.

Like to know more? Order your free copy of the MicroLine 2000 brochure today!

LPKF Laser & Electronics SE  •  Osteriede 7  •  30827 Garbsen  •  Germany  •  Tel.: +49 (0) 5131 7095-0  •  Fax: +49 (0) 5131 7095-90
© by LPKF