Solder Paste Deposits and the Precison of Aperture Sizes

Solder Paste Deposits and the Precison of Aperture Sizes

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Documenttype: Techpaper
Date: 01/Feb/2010

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The importance of the SMT stencil quality

60 to 75% of all board assembly problems stem from solder paste printing. The important outcome from the printing process is to get the correct amount of solder deposited in the right place.

A significant part of that solution is the stencil and its correctness depends on how well its manufacturing process is controlled using proper machines, materials, methods and manpower.

This report will show that significant variability exists in aperture size precision between various stencil manufacturing sources.

To learn more about solder paste deposits and the precison of aperture sizes register now to download your free copy and get library access.

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