Ultra-short pulse laser for gentle material processing

Ultra-short pulse laser for gentle material processing

Register to Download the Paper & Get free Library Access

We never give personal data to third parties without your allowance. You can edit or delete your account at any time.
Documenttype: Techpaper
Date: 16/Dec/2019

Your contact data
  1. Required fields are marked with an *.

Mandatory fields are marked with *
  or log in with existing account

Fast, accurate results with LPKF UKP systems

Bringing high energy to a small surface is the principle of laser processing. The wavelength of the laser and the duration of the energy input play a role in the effect. A continuous wave (CW) laser beam transmits the laser energy without interruptions. However, the energy input per area is comparatively low.

In the case of a pulsed beam, the laser energy is totalled for a moment and then emitted in a short pulse. Peak powers of individual pulses can be achieved by focussing spatially on a small area and by an extremely short pulse duration. For many materials and applications, material processing with ultra-short laser pulses has advantages for material properties, yield and efficiency.

Learn more about material processing with UKP laser systems and register to download your free copy of this techpaper.

LPKF Laser & Electronics AG  •  Osteriede 7  •  30827 Garbsen  •  Germany  •  Tel.: +49 (0) 5131 7095-0  •  Fax: +49 (0) 5131 7095-90
© by LPKF