Blind and Buried Vias for Multilayer Production

Blind and Buried Vias for Multilayer Production

Register to Download the Paper & Get free Library Access

We never give personal data to third parties without your allowance. You can edit or delete your account at any time.
Documenttype: Techpaper
Date: 21/Feb/2020

Your contact data
  1. Required fields are marked with an *.

Mandatory fields are marked with *
 
  or log in with existing account

Multilayer Sets for Blind and Buried Vias

When space requirements push your design to shrink further, or your BGA needs a more complex fan-out, blind and buried vias can help.

This well-known technology is often omitted if possible due to the increase of PCB production costs. Multilayers are also necessary when dealing with high speed data transfer to control signal line impedance and avoid crosstalk and disturbance.

Learn more about how we simplify your multilayer production of 4-, 6- and 8-layer printed circuit boards and register now for a free download of the Techpaper.

LPKF Laser & Electronics AG  •  Osteriede 7  •  30827 Garbsen  •  Germany  •  Tel.: +49 (0) 5131 7095-0  •  Fax: +49 (0) 5131 7095-90
© by LPKF