Blind and Buried Vias for Multilayer Production

Blind and Buried Vias for Multilayer Production

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Documenttype: Techpaper
Date: 21/Feb/2020

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Multilayer Sets for Blind and Buried Vias

When space requirements push your design to shrink further, or your BGA needs a more complex fan-out, blind and buried vias can help.

This well-known technology is often omitted if possible due to the increase of PCB production costs. Multilayers are also necessary when dealing with high speed data transfer to control signal line impedance and avoid crosstalk and disturbance.

Learn more about how we simplify your multilayer production of 4-, 6- and 8-layer printed circuit boards and register now for a free download of the Techpaper.

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