Blind and Buried Vias for Multilayer Production

Blind and Buried Vias for Multilayer Production

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Documenttype: Techpaper
Date: 24/Aug/2023

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Multilayer Sets for Blind and Buried Vias

When PCB design density becomes so tight on a multilayer design that even small 150um or 200um through-holes tend to obstruct the layout of additional pads and traces, the use of blind and buried vias can be a helpful technique for gaining more usable surface area. Blind and/or buried vias are commonly used with micro ball-grid arrays, flip-chips, and large BGAs.

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